THE 1950S

Integrated Circuit

At the end of World War II, the complex electronics of B-29 bombers faced a significant technical challenge: each aircraft carried nearly a thousand vacuum tubes and tens of thousands of passive components. This multiplication of elements led to an exponential increase in manufacturing costs and a worrying decline in reliability. American military forces, confronted with this technical reality, feared that this complexity would drastically hinder the evolution of electronic systems.

The National Bureau of Standards launched the first research efforts to simplify manufacturing. Centralab division of Globe-Union proposed an innovative technique based on ceramic substrates supporting metallic interconnections and capacitors, onto which miniaturized vacuum tubes were mounted. This method, resulting from the work of S.J. Rubenstein, Mr Ehlers, Gertrude B. Sherwood, and Howard J. White, marked the first attempt to create components in situ.

After 1945, work continued under the direction of R.L. Wolff and A.S. Khouri, and Centralab developed high-speed screen printing processes. The company manufactured amplifiers for hearing aids incorporating dozens of passive components and several tube sockets. The use of a substrate with a high dielectric constant enabled the economical production of RC networks intended for radios and televisions.

Everything changed with the arrival of the transistor in 1948. More compact, less power-hungry, and more reliable than the vacuum tube, it also generated less heat. However, its integration into existing circuits required a lengthy technological adaptation. Jack Kilby, at Texas Instruments, and Robert Noyce, at Fairchild Semiconductor, independently conceived the integrated circuit in 1958.

Kilby imagined that all components of a circuit could be manufactured in a block of semiconductor material. In September 1958, his demonstration of a phase-shift oscillator using transistors, resistors, and capacitors in germanium proved the validity of the concept. This pioneering approach used gold wire bonded interconnections that proved incompatible with industrial production, which was a significant drawback.

Noyce developed a different solution at Fairchild, based on Jean Hoerni’s planar technology. His design used silicon as a substrate, covered with an insulating oxide layer on which aluminum traces were deposited for interconnections. This method, better suited to industrialization, became the foundation of modern integrated circuit technology.

These inventions radically transformed electronics. Manufacturing complete circuits on a single silicon chip drastically reduced costs while spectacularly improving reliability. In 1961, Fairchild commercialized the Micrologic family, the first set of compatible logic circuits with diffused resistors and interconnections. That same year, Texas Instruments delivered to the US Air Force a small computer incorporating several hundred bits of semiconductor memory.

The integrated circuit industry followed an exponential trajectory, described by Gordon Moore in 1965: the number of transistors per circuit doubles approximately every two years. This prediction held true for over fifty years. From the first circuits containing a few thousand transistors, we have progressed to chips containing several billion components.

Technological advances have constantly reduced the size of transistors: from several microns in the 1970s to a few nanometers today. This miniaturization is accompanied by increased performance and reduced power consumption. Current technology is, however, approaching its physical limits, with transistors measuring only a few dozen atoms wide.

Integrated circuits made possible the personal computer, the mobile phone, the Internet, and artificial intelligence. The rise of the semiconductor industry has transformed the global economy, creating new sectors and changing our ways of life.

Faced with the physical constraints of miniaturization, researchers are now exploring three-dimensional integration or quantum computing. The power requirements for artificial intelligence and machine learning in the 21st century continue to drive innovation in this field.